DRIE operates on the principles of Reactive Ion Etching (RIE) but with enhanced capabilities for deep etching. The process alternates between etching and passivation steps. During the etching phase, ions and radicals generated in a plasma react with the substrate material to remove it. In the passivation phase, a protective layer is deposited to prevent lateral etching, allowing for the creation of deep, vertical sidewalls. This alternating process is known as the Bosch Process.
