High Aspect Ratios: DRIE can achieve aspect ratios greater than 20:1, which is essential for many nano-scale applications. Anisotropic Etching: The Bosch Process allows for highly anisotropic etching, resulting in vertical sidewalls with minimal undercut. Precision: DRIE provides excellent control over etching depth, making it ideal for creating precise nano-scale features. Versatility: It can be used on various substrates, including silicon, glass, and polymers.
