Despite its advantages, DRIE also presents several challenges:
Aspect Ratio Dependent Etching (ARDE): The etch rate can vary with aspect ratio, leading to non-uniform features. Surface Roughness: The etching process can result in rough sidewalls, which may require additional smoothing steps. Process Complexity: The Bosch Process involves multiple steps and requires precise control over process parameters. Equipment Cost: DRIE systems are expensive, which can be a barrier for some research and development environments.
