There are several etching techniques used in nanotechnology, each with its specific advantages and applications. The most common techniques include:
Wet Etching: Involves the use of liquid chemicals to remove material. It is generally isotropic and suitable for applications where anisotropy is not critical. Dry Etching: Uses plasma or ion beams to etch the material. It offers better control over anisotropy and is widely used in the semiconductor industry. Reactive Ion Etching (RIE): Combines chemical and physical etching mechanisms to achieve high anisotropy and selectivity. Deep Reactive Ion Etching (DRIE): A type of RIE optimized for creating deep, high-aspect-ratio structures.
