Despite its advantages, micro bumping presents several challenges:
Alignment Precision: Achieving precise alignment between the micro bumps and the corresponding pads is critical for ensuring reliable connections. Misalignment can lead to defects and failures. Thermal Management: Efficiently managing the heat generated during the reflow process and in the final device is crucial to prevent damage and ensure the longevity of the components. Material Compatibility: Ensuring compatibility between different materials used in the micro bumping process is essential to prevent issues like electromigration and oxidation.
