The micro bumping process typically involves several steps:
Design and Fabrication: The first step is to design the micro bumps and fabricate them on the wafer. This is done using photolithography and electroplating techniques to deposit metals like copper, gold, or solder on the wafer in the desired pattern. Wafer Bonding: Once the micro bumps are created, the wafer is aligned and bonded to another wafer or substrate. This can be achieved through techniques like flip-chip bonding, where the wafer is flipped and the bumps are aligned with the corresponding pads on the substrate. Reflow and Inspection: After alignment, the assembly is subjected to a reflow process, where the bumps melt and form a solid mechanical and electrical connection. The final step involves inspecting the connections to ensure their integrity and reliability.
