Several materials are commonly used in micro bumping, including:
Copper: Known for its excellent electrical conductivity, copper is often used for creating micro bumps in high-performance applications. Gold: Gold is used in applications requiring superior reliability and resistance to oxidation, although it is more expensive than other materials. Solder Alloys: Various solder alloys, such as tin-lead or lead-free solders, are used for their ability to form strong mechanical bonds at relatively low temperatures.
