What are the Challenges in Developing Advanced CMP Slurries?
Developing advanced CMP slurries involves several challenges, such as:
1. Selectivity: Achieving high selectivity to remove specific materials without damaging underlying layers. 2. Defectivity: Minimizing defects like scratches, pits, and erosion during the CMP process. 3. Uniformity: Ensuring consistent performance across the entire wafer surface. 4. Environmental Impact: Formulating slurries that are environmentally friendly and safe for handling.
