CMP slurries are composed of several key components:
1. Abrasive Particles: Typically, materials like silica, alumina, or ceria are used due to their hardness and ability to provide fine mechanical abrasion. 2. Chemical Agents: These include oxidizers, complexing agents, and pH adjusters that facilitate specific chemical reactions on the surface being polished. 3. Dispersants and Stabilizers: To ensure a uniform suspension of abrasive particles and to prevent agglomeration. 4. Surfactants: Used to control the wettability and to enhance the interaction between the slurry and the surface.
