Etching selectivity can be achieved through various methods, including:
Chemical Selectivity: Using specific chemicals that react more readily with the target material than with other materials. Physical Selectivity: Adjusting physical parameters such as ion energy, angle of incidence, and substrate temperature to preferentially etch the target material. Plasma Etching: Utilizing plasmas to generate reactive species that selectively etch the target material while leaving other materials relatively unaffected.
