1. Target Bombardment: Ions generated in a plasma are accelerated towards a target material, causing atoms to be ejected. 2. Reactive Gas Introduction: A reactive gas (such as oxygen, nitrogen, or methane) is introduced into the sputtering chamber. 3. Chemical Reaction: The ejected atoms react with the reactive gas to form a compound. 4. Film Formation: The compound is deposited onto the substrate, forming a thin film.
This process can be fine-tuned by adjusting parameters like gas flow rate, power supply, and pressure, allowing researchers to tailor the properties of the deposited film.
