Several techniques are used to create bonded wafers, each with its advantages and limitations:
Direct Bonding: In this method, two wafers are brought into contact and bonded at room temperature, followed by annealing to strengthen the bond. This technique is often used for silicon-on-insulator (SOI) wafers. Adhesive Bonding: An adhesive layer is applied between the wafers to bond them together. This method is versatile and can bond different types of materials. Anodic Bonding: This technique involves bonding a silicon wafer to a glass wafer by applying an electric field at elevated temperatures. It is commonly used in microelectromechanical systems (MEMS).
