What Are the Challenges in Bonded Wafer Technology?
Despite their advantages, bonded wafers face several challenges:
Surface Roughness: Achieving a smooth surface is critical for successful bonding. Any surface roughness can lead to voids and weak bonds. Thermal Mismatch: Different materials have different coefficients of thermal expansion, which can cause stress and potential failure of the bonded interface. Contamination: Contaminants can interfere with the bonding process, leading to defects and reduced yield.
