Fabricating photomasks involves several challenges, particularly as technology pushes towards smaller nodes. Key issues include:
Resolution: Achieving high resolution to match the decreasing size of semiconductor nodes. Defect Control: Reducing defects in masks that can propagate errors in chip manufacturing. Cost: The complexity of mask creation increases costs, impacting overall production expenses. Turnaround Time: Rapid production is needed to meet the demands of fast-paced technology development.