Despite its advantages, wafer bumping presents several challenges, including:
Alignment Precision: Ensuring the bumps are precisely aligned with the chip pads is critical for reliable interconnections. Thermal Management: The materials and processes must effectively manage heat to prevent damage to the chip and bumps. Material Compatibility: The materials used for the bumps must be compatible with the other materials in the package to avoid reliability issues such as electromigration and corrosion.
