There are various techniques employed for wafer bumping, including:
Electroplating: This method uses electrical current to deposit metal onto the wafer, creating uniform and highly conductive bumps. Stencil Printing: A solder paste is applied through a stencil to create the bumps. This method is less precise but is cost-effective for certain applications. Ball Placement: Solder balls are placed on pre-defined locations on the wafer, which are then reflowed to form bumps. This method is often used for larger bumps.
