The choice of materials for wafer bumping is critical. Commonly used materials include:
Tin-Lead Solder: Traditional material used due to its low melting point and ease of use, though it is being phased out due to environmental concerns. Lead-Free Solders: Composed of tin-silver-copper (SAC) alloys, these are more environmentally friendly and are increasingly being adopted in the industry. Gold: Often used for high-performance and high-reliability applications due to its excellent conductivity and resistance to oxidation.
