Despite their advantages, 3D ICs face several challenges, including:
1. Thermal Management: Heat dissipation becomes more complex as layers are added, necessitating advanced thermal management solutions. 2. Manufacturing Complexity: The fabrication process for 3D ICs is more intricate, requiring precise alignment and bonding techniques. 3. Yield Issues: The increased complexity can lead to lower yields, impacting cost and scalability. 4. Interconnect Reliability: Ensuring the reliability of inter-layer connections, especially TSVs, is critical for the performance and longevity of 3D ICs.
