The fabrication of 3D ICs involves several key processes, including through-silicon vias (TSVs), wafer bonding, and layer stacking. TSVs are vertical electrical connections that pass through silicon wafers, allowing for inter-layer communication. Wafer bonding techniques, such as direct wafer bonding or adhesive bonding, are used to stack the multiple layers of circuits. These processes are facilitated by advancements in nanotechnology, which enable precise control at the nanoscale.
