What Are the Key Properties of Effective Polishing Pads?
Effective polishing pads must have several key properties to be useful in nanotechnology. These include:
Durability: The pad should withstand the mechanical and chemical stress of the CMP process. Uniformity: The pad should provide a consistent polishing action across the entire surface of the wafer. Compatibility: The pad material should be compatible with the slurry and the wafer material. Porosity: Some porosity is beneficial for slurry distribution and debris removal.
