Despite its advantages, RIE also presents several challenges: - Etch Uniformity: Achieving uniform etching across a large substrate can be difficult. - Selectivity: Differentiating between materials to etch one while leaving another intact requires careful tuning. - Surface Damage: High-energy ions can cause damage to the substrate, affecting the performance of the nanodevices. - Aspect Ratio: Etching high aspect ratio structures can be challenging due to limitations in ion penetration and byproduct removal.
