Despite its advantages, flip chip technology faces several challenges:
Material Compatibility: Ensuring compatibility between the chip, solder bumps, and substrate materials is crucial to prevent issues such as thermal expansion mismatch and electromigration. Manufacturing Complexity: The precise placement and alignment of chips and solder bumps require advanced manufacturing techniques and equipment. Cost: The initial setup and materials can be more expensive compared to traditional methods, although the long-term benefits often justify the investment. Thermal Management: While flip chip technology improves heat dissipation, managing the thermal load in high-power applications remains a challenge.
