Flip chip technology offers several advantages over traditional wire bonding methods:
Improved Electrical Performance: The shorter connections reduce parasitic inductance and capacitance, leading to better signal integrity and faster data transmission. Enhanced Thermal Management: The direct connection allows for more efficient heat dissipation, which is crucial for high-performance devices. Higher Density Interconnections: Flip chip technology supports a higher number of connections per unit area, enabling more compact device designs. Greater Reliability: The uniform and robust connections reduce the risk of mechanical failure, enhancing the overall reliability of the device.
