Despite their benefits, 3D ICs face several challenges: - Thermal Management: Heat dissipation is more complex due to the stacked architecture. - Manufacturing Complexity: Fabrication processes are intricate and require high precision. - Cost: Advanced materials and processes make 3D ICs more expensive. - Reliability: Ensuring long-term reliability and addressing potential failure mechanisms is critical. - Design Tools: Existing design tools need to evolve to handle the complexities of 3D ICs.
