3D ICs offer numerous advantages: - Higher Performance: Shorter interconnects reduce signal delay and improve speed. - Lower Power Consumption: Reduced distance for signal travel lowers energy requirements. - Space Efficiency: Stacking reduces the overall footprint of the chip, ideal for compact devices. - Enhanced Functionality: Different layers can be optimized for various functions, such as logic, memory, or sensors. - Improved Bandwidth: Vertical stacking allows for higher bandwidth due to closer proximity of components.
