What are the Challenges Associated with Solder Bumps?
Several challenges arise in the use of solder bumps, including:
Scaling: As devices shrink, maintaining the reliability and performance of smaller solder bumps becomes complex. Thermal Management: Proper thermal management is essential to prevent degradation or failure of the solder joints. Material Compatibility: Ensuring that the solder material is compatible with both the device and substrate materials to avoid issues like electromigration and intermetallic formation.
