The creation of solder bumps involves several precise techniques, including:
Wafer Bumping: Solder is deposited on the wafer containing multiple semiconductor chips. Electroplating: A common method where solder is deposited through an electrochemical process. Screen Printing: Applying solder paste through a stencil onto the wafer. Ball Placement: Pre-formed solder balls are placed onto the wafer using a placement tool.
