3D integration offers numerous advantages, especially when combined with nanotechnology:
Performance Improvement: By reducing interconnect lengths, 3D integration significantly improves signal speed and bandwidth. Power Efficiency: Shorter interconnect distances reduce power consumption, which is crucial for mobile and compact devices. Higher Density: Stacking layers enables higher device density, allowing for more functionality in a smaller footprint. Enhanced Functionality: It allows for heterogeneous integration, combining different types of devices such as sensors, memory, and logic circuits in a single package.
