Despite its benefits, 3D integration presents several challenges:
Thermal Management: Managing heat dissipation in stacked layers is complex and requires advanced cooling solutions. Manufacturing Complexity: The fabrication process is intricate, involving precise alignment and bonding techniques at the nanoscale. Cost: The advanced materials and processes required can be expensive, making it challenging to scale for mass production. Reliability: Ensuring long-term reliability and minimizing defects in vertical interconnects is critical.
