Enhanced Performance: By reducing the distance that signals need to travel, 3D chip stacking improves signal speed and overall device performance. Power Efficiency: Shorter interconnects result in lower power consumption, which is critical for battery-powered devices and energy-efficient computing. Space Savings: Vertical stacking allows for more functionality in a smaller footprint, enabling further miniaturization of electronic devices. Improved Bandwidth: TSVs provide high-bandwidth interconnections between layers, which is essential for data-intensive applications.
