Despite its advantages, 3D chip stacking also presents several challenges:
Thermal Management: Stacked layers generate more heat, and efficient thermal dissipation becomes crucial to prevent overheating and ensure reliability. Manufacturing Complexity: The process of aligning and bonding multiple layers with precise TSV placement is complex and requires advanced manufacturing techniques. Cost: The sophisticated equipment and processes involved in 3D chip stacking can increase production costs. Yield: The more layers involved, the higher the potential for defects, which can affect overall yield and reliability.
