In pulse plating, the current or voltage is applied in a series of pulses. Each pulse consists of an on-time and an off-time. During the on-time, metal ions are reduced and deposited onto the substrate. During the off-time, no deposition occurs, allowing the ions to diffuse and redistribute more evenly. By carefully controlling the pulse parameters, such as pulse duration, frequency, and duty cycle, researchers can optimize the deposition process for various applications.
