Photoresist Application: A photoresist material is applied to the silicon wafer. This material is sensitive to deep ultraviolet light. Exposure: The wafer is exposed to DUV light through a mask that contains the desired pattern. The light alters the chemical structure of the photoresist in the exposed areas. Development: The wafer is developed in a chemical solution that removes the exposed or unexposed photoresist, depending on whether a positive or negative resist is used. Etching: The pattern is then etched into the wafer using various techniques, such as reactive ion etching, to create the final nanoscale structures.
