plasma assisted atomic layer deposition (pa ald)

Why Use Plasma in ALD?

The use of plasma in ALD offers several advantages:
Enhanced Reactivity: Plasma provides the necessary energy to drive reactions at lower temperatures, making it possible to deposit high-quality films on thermally sensitive substrates.
Improved Film Quality: Plasma can improve the density and uniformity of the deposited films, leading to better electrical and mechanical properties.
Wider Material Range: The reactive species generated in the plasma phase can enable the deposition of materials that are difficult to achieve using thermal ALD.

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