Microelectromechanical Systems (MEMS) and Nanoelectromechanical Systems (NEMS) are particularly susceptible to stiction. During the fabrication process or operational lifetime, the small components can adhere to each other or to substrates, leading to device failure. This phenomenon restricts the movement of components such as beams, gears, and cantilevers, significantly impacting the reliability and functionality of MEMS and NEMS devices.
