There are several deposition techniques used in nanotechnology:
Physical Vapor Deposition (PVD): In this method, material is vaporized in a vacuum environment and then condensed onto a substrate. Techniques include sputtering and thermal evaporation. Chemical Vapor Deposition (CVD): This process involves chemical reactions that occur in the gas phase to produce a solid material that deposits on a substrate. Variants include plasma-enhanced CVD (PECVD) and low-pressure CVD (LPCVD). Atomic Layer Deposition (ALD): A highly precise method that involves the sequential use of gas phase chemical processes to deposit atomic layers of material. Electrochemical Deposition: This technique involves the reduction of metal ions from a solution to form a thin film on a conductive substrate. Spin Coating: Commonly used for depositing uniform thin films, this method involves depositing a small amount of solution onto the center of a substrate and spinning it at high speed.
