What are the Key Technologies Used in Advanced Packaging?
1. 3D Integration: This involves stacking multiple layers of semiconductors to create a three-dimensional structure, significantly increasing device density and performance. 2. Through-Silicon Vias (TSVs): These are vertical electrical connections that pass through the silicon wafers, enabling direct interconnects between different layers. 3. Wafer-Level Packaging (WLP): This method involves packaging at the wafer level rather than the individual chip level, allowing for better alignment and reduced size. 4. Flip Chip Technology: This technique involves flipping the chip and connecting it directly to the substrate, offering better electrical performance and heat dissipation.
