1. Surface Preparation: The surfaces of the wafers are cleaned and polished to remove contaminants and achieve a high degree of flatness. 2. Alignment: The wafers are precisely aligned to ensure that the structures and features on each wafer properly match. 3. Contact: The wafers are brought into contact, typically in a vacuum or controlled atmosphere, to avoid the introduction of particles between the surfaces. 4. Pre-bonding: An initial weak bond is formed at room temperature. 5. Annealing: The wafers are heated to strengthen the bond through atomic diffusion and interface reactions.
