direct wafer bonding

What are the Advantages of Direct Wafer Bonding?

- Material Versatility: Direct wafer bonding allows for the integration of dissimilar materials, such as silicon and III-V semiconductors, which is critical for heterogenous integration.
- High Precision: The method provides excellent alignment accuracy, essential for nanoscale devices.
- No Intermediate Layers: The absence of adhesives or intermediate layers reduces the risk of contamination and improves the thermal and electrical conductivity of the bond.

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