There are several methods used for nanopatterning, each with its advantages and limitations:
Photolithography: This is one of the most widely used techniques in the semiconductor industry. It involves using light to transfer a pattern from a mask to a light-sensitive chemical (photoresist) on the substrate. Electron Beam Lithography (EBL): EBL uses a focused beam of electrons to write patterns directly onto a substrate. It offers higher resolution than photolithography but is generally slower and more expensive. Nanoimprint Lithography (NIL): NIL involves pressing a mold with nanoscale features into a polymer layer on a substrate, followed by curing the polymer to create the pattern. Dip-Pen Nanolithography (DPN): This method uses an atomic force microscope (AFM) tip coated with a molecular "ink" to directly write patterns onto a surface. Self-Assembly: This technique relies on the natural tendency of molecules to organize into predefined structures, allowing for the creation of complex nanoscale patterns with minimal external intervention.
