What are the Challenges in Nanotechnology-Based Packaging?
Despite its numerous advantages, nanotechnology-based semiconductor packaging faces several challenges:
Manufacturing Complexity: The integration of nanomaterials and nanoscale processes into packaging requires advanced manufacturing techniques, which can be complex and costly. Material Compatibility: Ensuring compatibility between nanomaterials and existing packaging materials can be challenging, as it requires careful consideration of their chemical and physical properties. Reliability and Testing: The long-term reliability and performance of nanotechnology-based packaging need to be thoroughly tested and validated, which can be time-consuming and resource-intensive.
