3D stacking offers several advantages over traditional 2D ICs:
Improved Performance: The reduced distance between layers results in faster signal transmission and lower latency. Higher Density: Vertical stacking allows for more components to be packed into a smaller footprint, increasing the overall density of the IC. Power Efficiency: Shorter interconnects reduce power consumption, making devices more energy-efficient. Enhanced Functionality: Different technologies (e.g., logic, memory, sensors) can be integrated into a single package, offering more functionality in a compact form.
