Traditional metallic interconnects suffer from resistive and capacitive losses, which contribute to signal delay. Nanotechnology enables the development of nanoscale interconnects that have lower resistance and capacitance. This is achieved through: - Thin Films and Coatings: Applying nanomaterials as thin films on traditional interconnects can enhance their electrical properties. - Nano-patterning Techniques: Advanced lithography methods allow precise patterning of interconnects at the nanoscale, reducing parasitic effects.
