How Does Monolithic 3D Integration Differ From Conventional 3D Integration?
Traditional 3D integration typically involves stacking separate chips and connecting them using TSVs, which introduces issues such as increased parasitic resistance and inductance. Monolithic 3D integration, on the other hand, builds multiple layers of transistors sequentially on a single wafer. This method reduces the need for TSVs and allows for more efficient heat dissipation and interconnects.
