In DC Sputtering, a target material is placed in a vacuum chamber and subjected to a high voltage. Argon gas is introduced, and the voltage ionizes the argon atoms, creating a plasma. The positively charged argon ions are accelerated towards the negatively charged target, causing atoms from the target to be ejected. These ejected atoms then condense on the substrate, forming a thin film. This process is particularly useful for creating high-quality nanofilms and nanocoatings.
