The process of using photoresists involves several steps, typically including coating, exposure, development, and post-processing.
Coating: A thin layer of photoresist is applied to the substrate using techniques like spin coating or spray coating. Exposure: The photoresist-coated substrate is exposed to light through a mask containing the desired pattern. The type of light used can vary, from UV to X-rays, depending on the resolution required. Development: The exposed substrate is immersed in a developer solution that selectively dissolves either the exposed or unexposed areas, depending on the type of photoresist used. Post-Processing: Additional steps like baking or etching may be performed to finalize the pattern and prepare the substrate for further processing.
