The production of silicon wafers begins with the mining of silicon, usually from quartz. The silicon is then purified to a very high degree, often 99.9999% pure or higher. This ultra-pure silicon is melted and then crystallized into cylindrical ingots through a process known as the Czochralski method. The ingots are sliced into thin wafers and polished to create a smooth, defect-free surface suitable for lithography and other microfabrication techniques.
