Detecting mask defects is crucial for ensuring high yield and performance. Various techniques are employed for this purpose:
Optical Inspection: Uses light to scan the mask surface for defects. This method is quick but may not detect very small defects. Electron Beam Inspection: Provides higher resolution by using electron beams, but is slower and more expensive. Actinic Inspection: Uses the same wavelength of light as the lithography process, making it highly accurate for defect detection.
