What Techniques are Used to Overcome These Challenges?
Several advanced techniques are employed to overcome the challenges associated with smaller technology nodes:
Extreme Ultraviolet Lithography (EUV): This advanced lithography technique uses extremely short wavelengths of light to create finer patterns on silicon wafers. FinFET Technology: Fin Field-Effect Transistor (FinFET) is a type of multi-gate transistor that offers better control over the channel, reducing leakage current and improving performance. 3D Integration: Stacking multiple layers of circuits vertically can enhance performance and reduce latency, making better use of the available space on a chip.
