Doping: Introducing impurities into the semiconductor material to modify its electrical properties. Strain Engineering: Applying mechanical stress to alter the electronic properties of the material. Silicidation: Forming silicide contacts to reduce resistance and improve current flow. High-K Dielectrics: Using materials with a high dielectric constant to improve capacitance and reduce leakage. Contact Engineering: Optimizing the metal-semiconductor interface to reduce contact resistance.
